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Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method
(Scientific.Net, 2012-04-12)
The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many ...