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Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2014)
The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, ...
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
(Trans Tech Publications, 2013)
To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. ...
Zn-Sn based high temperature solder - A short review
(Trans Tech Publications, 2013)
The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ...