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Research development of solder materials and its intermetallic compound (IMC) study
(Scientific.Net/Trans Tech Publications, 2012-12)
Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
(EDP Sciences, 2016-10)
The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. ...
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
(MDPI AG, 2021-02)
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ...
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
(Scientific.Net, 2012-12)
Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ...