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    An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite 

    Norainiza, Saud; Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul Izwan, Ramli; Norhayanti, Mohd Nasir (EDP Sciences, 2016)
    In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ...
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    Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder 

    Mohd Izrul Izwan, Ramli; ‪Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Rita, Mohd Said; Norainiza, Saud (EDP Sciences, 2016-10)
    The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. ...

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    AuthorMohd Izrul Izwan, Ramli (2)Mohd Nazree, Derman (2)Norainiza, Saud (2)Rita, Mohd Said (2)Mohd Arif Anuar, Mohd Salleh (1)... View MoreSubjectSolder (2)Activated Carbon (AC) (1)Intermetallic compound (1)Titanium oxide (TiO2) (1)... View MoreDate Issued
    2016 (2)

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