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    Synthesis and characterization of electroless copper coated SiC particles 

    Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman, Dr. (Trans Tech Publications, 2013)
    Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp ...
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    Overview of pathogenic micro-organisms destruction in contaminated water by oxide photocatalysis 

    Noor Azira, Mohd Noor; Muhammad Asri, Idris, Dr.; Dewi Suriyani, Che Halin, Dr.; Mohd Nazree, Derman, Dr.; Mohd Arif Anuar, Mohd Salleh (Trans Tech Publications, 2013)
    The titanium dioxide (TiO2) is a semiconductor oxide photocatalys, which is chemically and biologically inert but exhibits excellent photolytic activity in the ultraviolet (UV) region. Progress in photocatalytic water ...
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    Preparation of cyciopentyi trisiianoi siisesquioxanes - modified natural rubber (CpSSQ(OH)3 - ENR-50) composite hybrid in the presence of HCI acid 

    Rosniza, Hamzah; Mohamad, Abu Bakar, Prof.; Nik Noriman, Zulkepli, Dr.; Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al-Bakri, Abdullah (Trans Tech Publications, 2013)
    A composite comprising cyclopentyl trisilanol siisesquioxanes (CpSSQ(OH)3) and 50% epoxidized natural rubber (ENR-50) was prepared at reflux temperature employed hydrochloric acid (HCl) as catalyst. HCl was found to be an ...
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    A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods 

    Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Sandu, Andrei Victor; Norainiza, Saud; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; McDonald, Stuart D.; Nogita, Kazuhiro (Syscom 18 SRL, 2013-07)
    The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ...
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    Strength of concrete based cement using recycle ceramic waste as aggregate 

    Mohd Mustafa Al-Bakri, Abdullah; Norazian, Mohamed Noor; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Mohd Arif Anuar, Mohd Salleh; Adila, Abdullah (Trans Tech Publications, 2013)
    The main focus of this research is to study the strength of concrete with ceramic waste as coarse aggregate. The sources of ceramic waste are obtained from the industrial in Malaysia. Presently, in ceramics industries the ...
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    The effect of different alkaline treatment condition on flexural properties of kenaf bast- unsaturated polyester composite 

    Rozyanty, Abdul Rahman; Nur Firdaus, M. Y.; Mohd Arif Anuar, Mohd Salleh; Luqman, Musa, Dr. (Trans Tech Publications, 2013)
    The biocomposites were prepared by using kenaf bast fiber mat as reinforcing materials at different percentage. The kenaf bast fiber was treated with alkaline at different sodium hydroxide (NaOH) percentage. From the results ...
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    Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review 

    Mohd Arif Anuar, Mohd Salleh; McDonald, Stuart D.; Nogita, Kazuhiro (Trans Tech Publications, 2013)
    To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. ...
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    Microstructure studies on different types of Geopolymer materials 

    Mohd Mustafa Al Bakri, Abdullah; Adila, Abdullah; Muhammad Faheem, Mohd Tahir; Che Mohd Ruzaidi, Ghazali, Assoc. Prof.; Mohd Arif Anuar, Mohd Salleh; Sandu, AV (Trans Tech Publications, 2013)
    Geopolymer is a new binding material produced to substitute the ordinary Portland cement (OPC) function as a binder in concrete. As we know, different types of geopolymer will have different properties. In this research, ...
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    Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate 

    Mohd Arif Anuar, Mohd Salleh; Noraniza, Saud; Najib Saedi, Ibrahim (Trans Tech Publications, 2013)
    The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its ...
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    Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder 

    Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Nik Noriman, Zulkepli, Dr.; Khairel Rafezi, Ahmad, Dr.; Mayappan, Ramani; Noor Farhani, Mohd Alui (Trans Tech Publications, 2013)
    Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 ...
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    AuthorMohd Arif Anuar, Mohd Salleh (15)Mohd Mustafa Al Bakri, Abdullah (3)Nik Noriman, Zulkepli, Dr. (3)Adila, Abdullah (2)Azmi, Kamardin (2)... View MoreSubjectComposite (2)Intermetallic (2)Lead-free composite solder (2)Lead-free solder (2)Powder metallurgy (2)... View MoreDate Issued
    2013 (15)

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