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    Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method 

    Iziana, Yahya; Noor Asikin, Ab Ghani; Mohd Arif Anuar, Mohd Salleh; Hamidi, Abd Hamid; Zainal Arifin, Ahmad; Mayappan, Ramani (Scientific.Net, 2012-04-12)
    The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many ...
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    Research development of solder materials and its intermetallic compound (IMC) study 

    Mohd Arif Anuar, Mohd Salleh; Najib Saedi, Ibrahim; Saud, N.; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
    Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...
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    Research advances of composite solder material fabricated via powder metallurgy route 

    Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
    Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
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    Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder 

    Flora Somidin; Mohd Arif Anuar, Mohd Salleh; Khairel Rafezi, Ahmad, Dr. (Scientific.Net, 2012-12)
    Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ...

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    AuthorMohd Arif Anuar, Mohd Salleh (4)Mohd Mustafa Al Bakri, Abdullah (2)Nik Noriman, Zulkepli (2)Ramani, Mayapan (2)Zainal Ariffin, Ahmad (2)... View MoreSubjectComposite (2)Composite solder (2)Intermetallic compound (2)Lead-Free solder (2)Powder metallurgy (2)... View MoreDate Issued
    2012 (4)

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