Search
Now showing items 1-3 of 3
Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method
(Scientific.Net, 2012-04-12)
The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many ...
Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder
(Trans Tech Publications, 2013)
Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 ...
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
(Trans Tech Publications, 2013)
Varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminium beverage cans were successfully reincorporated into Sn-0.7Cu base matrix solder material via powder metallurgy ...