Now showing items 1-2 of 2

    • The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint 

      Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Rita, Mohd Said; Mohd Mustafa Al Bakri, Abdullah; Dewi Suriyani, Che Halin; Norainiza, Saud; Nabiałek, Marcin (MDPI AG, 2021-02)
      The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ...
    • Microstructure evolution of Ag/TiO₂ thin film 

      Dewi Suriyani, Che Halin; Kamrosni, Abdul Razak; Mohd Arif Anuar, Mohd Salleh; Mohd Izrul Izwan, Ramli; Mohd Mustafa Al Bakri, Abdullah; Ayu Wazira, Azhari; Kazuhiro, Nogita; Hideyuki, Yasuda; Nabiałek, Marcin; Wysłocki, Jerzy J. (MDPI AG, 2021-01)
      Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure ...