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dc.contributor.authorGoh, Teck Joo
dc.contributor.authorSeetharamu, Kankanhally N.
dc.contributor.authorGhulam, Abdul Quadir, Prof. Dr.
dc.contributor.authorZainal Alimuddin, Zainal Alauddin, Dr.
dc.contributor.authorGaneshamoorthy, K. Jeevan
dc.date.accessioned2014-04-23T05:06:44Z
dc.date.available2014-04-23T05:06:44Z
dc.date.issued2004
dc.identifier.citationMicroelectronics International, vol. 21(3), 2004, pages 29-43en_US
dc.identifier.issn1356-5362
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33947
dc.descriptionLink to publisher's homepage at http://www.emeraldinsight.com/en_US
dc.description.abstractThis paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources in silicon chip design layout that leads to the desired junction temperature, Tj. Key thermal parameters investigated are the heat source placement distance, level of heat dissipation, and magnitude of convection heat transfer coefficient. Finite element method (FEM) is used to investigate the effect of the key parameters. From the FEM results, a multiple linear regression model employing the least-square method is developed that relates all three parameters into a single correlation which would predict the maximum junction temperature, Tj,max.en_US
dc.language.isoenen_US
dc.publisherEmerald Group Publishing Limiteden_US
dc.subjectDissipation factoren_US
dc.subjectFinite element analysisen_US
dc.subjectProgramming and algorithm theoryen_US
dc.subjectRegression analysisen_US
dc.titleThermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimizationen_US
dc.typeArticleen_US
dc.identifier.urlhttp://dx.doi.org/10.1108/13565360410549701
dc.identifier.urlhttp://www.emeraldinsight.com/journals.htm?articleid=1508847
dc.contributor.urlteck.joo.goh@intel.comen_US
dc.contributor.urlknseetharamu@hotmail.comen_US
dc.contributor.urlgaquadir@unimap.edu.myen_US


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