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dc.contributor.authorGoh, Teck Joo
dc.contributor.authorSeetharamu, Kankanhally N.
dc.contributor.authorGhulam, Abdul Quadir, Prof. Dr.
dc.contributor.authorZainal Alimuddin, Zainal Alauddin, Dr.
dc.contributor.authorJeevan, Kanesan
dc.date.accessioned2014-04-23T03:29:54Z
dc.date.available2014-04-23T03:29:54Z
dc.date.issued2004
dc.identifier.citationMicroelectronics International, vol. 21(2), 2004, pages 29-35en_US
dc.identifier.issn1356-5362
dc.identifier.urihttp://www.emeraldinsight.com/journals.htm?articleid=878475
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33934
dc.descriptionLink to publisher's homepage at http://www.emeraldinsight.com/en_US
dc.description.abstractThis paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal design was modeled to simulate a typical thermal design of microprocessor. Key thermal design parameters investigated are the heat source placement distance and level of heat dissipation. Verification of the proposed method was carried out by comparing the results with FEA predictions. Results of the verification show that the proposed method is reasonably accurate for practical purposes. A successful attempt has been made to predict the junction temperature of silicon chip with non-uniform power distribution in a simple way.en_US
dc.language.isoenen_US
dc.publisherEmerald Group Publishing Limiteden_US
dc.subjectHeat transferen_US
dc.subjectInterpolationen_US
dc.subjectMicroprocessor chipsen_US
dc.subjectTemperature distributionen_US
dc.titlePrediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approachen_US
dc.typeArticleen_US
dc.identifier.urlhttp://dx.doi.org/10.1108/13565360410531999
dc.contributor.urlknseetharamu@hotmail.comen_US
dc.contributor.urlgaquadir@unimap.edu.myen_US


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