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dc.contributor.authorKulkarni, Venkatesh M.
dc.contributor.authorSeetharamu, Kankanhally N.
dc.contributor.authorAswatha Narayana, P. A.
dc.contributor.authorIshak, Abdul Azid, Dr.
dc.contributor.authorGhulam, Abdul Quadir, Prof. Dr.
dc.date.accessioned2014-04-21T07:28:48Z
dc.date.available2014-04-21T07:28:48Z
dc.date.issued2004
dc.identifier.citationProceedings of 6th Electronics Packaging Technology Conference, 2004, pages 615-619en_US
dc.identifier.isbn0-7803-8821-6
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33885
dc.descriptionLink to publisher's homepage at http://ieeexplore.ieee.org/en_US
dc.description.abstractIn this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled with technique to keep track of the flow front. Solver uses general convection-diffusion equations and solves flow equations using CBS method in conjunction with finite element method (FEM). The fluid front tracking is carried out using Volume of Fluid (VOF) technique. The velocity field obtained from CBS scheme is used in pseudo-concentration approach to track the advancement of fluid front. A particular value of the pseudo-concentration variable is chosen to represent the free fluid surface demarcating the mold compound and air regions which can be tracked for each time step. Simulation has been carried out for a particular geometry of a flip- chip package. The results obtained are in good agreement with literature and experimental data.en_US
dc.language.isoenen_US
dc.publisherIEEE Conference Publicationsen_US
dc.subjectCharacteristic based split (CBS)en_US
dc.subjectFluid flow equationen_US
dc.subjectOnvection-diffusion equationen_US
dc.subjectVolume of fluid (VoF)en_US
dc.subjectFlip chip devicesen_US
dc.titleFlow analysis for flip chip underfilling process using characteristic based split methoden_US
dc.typeWorking Paperen_US
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=1396681&tag=1
dc.identifier.urlhttp://dx.doi.org/10.1109/EPTC.2004.1396681
dc.contributor.urlknseetharamu@hotmail.comen_US
dc.contributor.urlishak@eng.usm.myen_US
dc.contributor.urlgaquadir@unimap.edu.myen_US


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