Show simple item record

dc.contributor.authorLee, Kor Oon
dc.contributor.authorOng, Kang E.
dc.contributor.authorSeetharamu, Kankanhally N.
dc.contributor.authorIshak, Abdul Azid, Dr.
dc.contributor.authorGhulam, Abdul Quadir, Prof. Dr.
dc.contributor.authorGoh, Teck Joo
dc.date.accessioned2014-04-19T16:22:25Z
dc.date.available2014-04-19T16:22:25Z
dc.date.issued2006
dc.identifier.citationMicroelectronics International, vol. 23(2), 2006, pages 37-44en_US
dc.identifier.issn1356-5362
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33853
dc.descriptionLink to publisher's homepage at http://www.emeraldinsight.com/en_US
dc.description.abstractPurpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance of a flip chip package. Design/methodology/approach: The method uses the ANSYSTM finite element analysis tool along with Anand's viscoplastic constitutive law. Darveaux's crack growth rate model was applied to calculate solder joint characteristic life using simulated viscoplastic strain energy density results at the package substrate and printed circuit board solder joints. Two package configurations are evaluated with the above methodology, with the first being a simplified flip chip model and the second being a detailed flip chip model. Each of these configurations is subjected to two accelerated temperature cycling tests. Findings: Generally, the results indicate that the solder joint at the corner end of the package tends to fail first. The characteristic lives of solder joint at the package ball/board interface are 24-46 percent higher than the characteristic lives of solder joint at the package ball/substrate interface. This means that the interface between the solder ball and substrate will fail first before the interface between the solder ball and the board. Originality/value: Demonstrates that genetic algorithms can be used as tools to predict possible package dimensional values for given constraints on solder joint life.en_US
dc.language.isoenen_US
dc.publisherEmerald Group Publishingen_US
dc.subjectJoining materialsen_US
dc.subjectReliability managementen_US
dc.subjectSoldersen_US
dc.titleApplication of artificial intelligence for the determination of package parameters for a desired solder joint fatigue lifeen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.emeraldinsight.com/journals.htm?articleid=1550669
dc.identifier.urlhttp://dx.doi.org/10.1108/13565360610659707
dc.contributor.urlishak@eng.usm.myen_US
dc.contributor.urlgaquadir@unimap.edu.myen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record