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Wettability, electrical and mechanical properties of 99.3Sn-0.7Cu/Si 3N4 novel lead-free nanocomposite solder
(Trans Tech Publications, 2011-07-04)
A nanocomposite solder alloy with 99.3Sn-0.7Cu base alloy was successfully fabricated using the powder metallurgy route which consists of blending, compaction and sintering. Varying amount of nano size silicon nitride ...