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Stress intensity factors under combined bending and torsion moments
(Zhejiang University and Springer-Verlag Berlin Heidelberg, 2012-01)
This paper discusses stress intensity factor (SIF) calculations for surface cracks in round bars subjected to combined torsion and bending loadings. Different crack aspect ratios, a/b, ranging from 0.0 to 1.2 and relative ...
Dicing die attach film for 3D stacked die QFN packages
(IEEE Conference Publications, 2012)
The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process ...