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Now showing items 1-6 of 6
A study of workers posture on napier harvest process
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)
Workers in the agriculture industry are extremely exposed to the risk of musculoskeletal disorders (MSDs) either in short or long term which is directly affected to the production outputs. As initial, this paper will review ...
Stress intensity factors under combined bending and torsion moments
(Zhejiang University and Springer-Verlag Berlin Heidelberg, 2012-01)
This paper discusses stress intensity factor (SIF) calculations for surface cracks in round bars subjected to combined torsion and bending loadings. Different crack aspect ratios, a/b, ranging from 0.0 to 1.2 and relative ...
Strength and fracture characteristics of shear adhesive dissimilar joint
(Universiti Malaysia Perlis (UniMAP), 2012-02-27)
In this study, the effect of bond thickness upon the
shear strength of epoxy adhesively bonded joint with dissimilar
adherends is addressed. The bond thickness, t between the
adherends is controlled to be ranged from ...
Magnetic force simulations and analysis for conceptual absorber system
(Universiti Malaysia Perlis (UniMAP), 2012-02-27)
This paper presents the magnetic force simulations
and analysis for conceptual absorber system. The conceptual
magnetic absorber system has been proposed as a new concept
for vibration energy dissipation method by using ...
Elastic crack interaction limit of two interacting edge cracks in finite body
(Universiti Malaysia Perlis (UniMAP), 2012-02-27)
In certain range of crack interval ratio and crack
width ratio, the neighboring cracks will affect the changes of
stress field interaction around the crack tip, thus induced
significant changes in stress intensity factor. ...
Dicing die attach film for 3D stacked die QFN packages
(IEEE Conference Publications, 2012)
The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process ...