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Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
(Emerald Group Publishing Limited, 2004)
This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...
Finite element modelling of solidification phenomena
(Springer India, 2001)
The process of solidification process is complex in nature and the simulation of such process is required in industry before it is actually undertaken. Finite element method is used to simulate the heat transfer process ...
Optimization of fins used in electronic packaging
(Emerald Group Publishing Limited, 2005)
Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...