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A quick and accurate estimation of heat losses from a cow
(Elsevier Ltd., 2006)
The mathematical model available in the literature to calculate the skin temperature required to determine the heat loss from the body of an average cow under different environmental and skin-wetness conditions is complex ...
Numerical analysis and experimental investigation into the performance of a wire-on-tube condenser of a retrofitted refrigerator
(Elsevier Ltd., 2006)
The present paper discusses (a) the analysis of a wire-on-tube condenser under varying operating conditions of free convection using FEM, and (b) experimental verification of the performance of two wire-on-tube condensers ...
Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
(Emerald Group Publishing, 2006)
Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ...
Test chip and substrate design for flip chip microelectronic package thermal measurements
(Emerald Group Publishing Limited, 2006)
Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...
Numerical simulation of underfill encapsulation process based on characteritsic split method
(John Wiley & Sons, Inc., 2006)
Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...