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Analysis of microchannel heat exchangers using FEM
(Emerald Group Publishing, 2000)
A finite element method is applied to evaluate the performance of microchannel heat exchangers that are used in electronic packaging. The present approach is validated against the CFD data available in the literature. A ...
Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages
(IEEE Conference Publications, 2000)
In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure ...