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Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
(Emerald Group Publishing Limited, 2004)
This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...
Test chip and substrate design for flip chip microelectronic package thermal measurements
(Emerald Group Publishing Limited, 2006)
Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...