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Flip chip thermal test vehicle design: Requirements, evaluations, and validations
(ASME, 2003)
This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ...
Fast transient solutions for heat transfer [FEM]
(IEEE Conference Publications, 2003)
The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ...