Search
Now showing items 1-3 of 3
Application of artificial neural network for fatigue life prediction
(Trans Tech Publications, 2005)
An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the ...
Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
(Emerald Group Publishing, 2006)
Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ...
Optimization of fins used in electronic packaging
(Emerald Group Publishing Limited, 2005)
Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...