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Application of artificial neural network for fatigue life prediction
(Trans Tech Publications, 2005)
An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the ...
Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
(Emerald Group Publishing, 2006)
Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ...
Optimization of thermal resistance of stacked micro-channel using genetic algorithms
(Emerald Group Publishing Limited, 2005)
Purpose - To determine the optimal dimensions for a stacked micro-channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach - GA is used as an optimization tool for optimizing ...
Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
(Emerald Group Publishing Limited, 2005)
Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...
Optimization of PCB component placement using genetic algorithm
(World Scientific Publishing, 2002)
This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation ...
Numerical simulation of underfill encapsulation process based on characteritsic split method
(John Wiley & Sons, Inc., 2006)
Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...
Optimization of liquid cooling fins in microelectronic packaging
(Taylor & Francis Online, 2005)
The present study investigates the heat transfer from a fin of the combination of cone and frustum of a cone immersed in boiling FC-72. The temperature distribution within the fin is determined with the help of a ...
Optimization of fins used in electronic packaging
(Emerald Group Publishing Limited, 2005)
Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...
Flow analysis for flip chip underfilling process using characteristic based split method
(IEEE Conference Publications, 2004)
In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ...