Search
Now showing items 21-29 of 29
Numerical simulation of underfill encapsulation process based on characteritsic split method
(John Wiley & Sons, Inc., 2006)
Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...
Optimization of liquid cooling fins in microelectronic packaging
(Taylor & Francis Online, 2005)
The present study investigates the heat transfer from a fin of the combination of cone and frustum of a cone immersed in boiling FC-72. The temperature distribution within the fin is determined with the help of a ...
Finite element modelling of solidification phenomena
(Springer India, 2001)
The process of solidification process is complex in nature and the simulation of such process is required in industry before it is actually undertaken. Finite element method is used to simulate the heat transfer process ...
Experimental investigation of a downdraft biomass gasifier
(Elsevier Ltd., 2002)
An experimental investigation of a downdraft biomass gasifier is carried out using furniture wood and wood chips. The effect of equivalence ratio on the gas composition, calorific value and the gas production rate is ...
Optimization of fins used in electronic packaging
(Emerald Group Publishing Limited, 2005)
Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...
Steady state finite element analysis of a double stack cold plate with heat losses
(Springer-Verlag, 2003)
A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted ...
Flow analysis for flip chip underfilling process using characteristic based split method
(IEEE Conference Publications, 2004)
In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ...
Transient analysis of a liquid solar collector
(Elsevier Ltd., 2005)
An unsteady state analysis of a liquid solar collector is presented. The physical parameters, which govern the system, are identified. The governing equations have been solved using the fourth order Runge-Kutta method for ...
Fast transient thermal analysis of Fourier and non-Fourier heat conduction
(Elsevier Ltd., 2007-10)
In this paper, asymptotic waveform evaluation (AWE) has been successfully used for fast transient characterization of Fourier and non-Fourier heat conduction. The Fourier and non-Fourier equations are reduced to a system ...