Browsing Ghulam Abdul Quadir, Prof. Dr. by Author "Chiu, Chiapin"

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    • Test chip and substrate design for flip chip microelectronic package thermal measurements 

      Goh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2006)
      Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...