Browsing Ghulam Abdul Quadir, Prof. Dr. by Subject "Characteristic Based Split (CBS) method"

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    • Numerical simulation of underfill encapsulation process based on characteritsic split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr. (John Wiley & Sons, Inc., 2006)
      Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...