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    • Thermal management of multichipmodule (MCM) using genetic algorithms 

      Jeevan, Kanesan; Seetharamu, Kankanhally N.; Ishak, I.A.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2003)
      The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. ...