Browsing Ghulam Abdul Quadir, Prof. Dr. by Subject "Volume Of Fluid Technique (VOF)"
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Numerical simulation of underfill encapsulation process based on characteritsic split method
(John Wiley & Sons, Inc., 2006)Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...