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    • Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Jeevan, Kanesan (Emerald Group Publishing Limited, 2004)
      This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...