Browsing Ghulam Abdul Quadir, Prof. Dr. by Subject "Finite element analysis"
Now showing items 1-11 of 11
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Analysis of a Three-Fluid cocurrent and countercurrent parallel flow heat exchanger
(Universiti Malaysia Perlis, 2009-10-11)The temperature variation of the fluids in a three-fluid cocurrent and countercurrent parallel flow heat exchanger is measured and compared with the results obtained from the finite element analysis. It is found that finite ... -
Fast transient solution of a two-layered counter-flow microchannel heat sink
(Emerald Group Publishing Limited., 2009)Purpose: The purpose of this paper is to apply asymptotic waveform evaluation (AWE) to the transient analysis of a two-layered counter-flow microchannel heat sink. Design/methodology/approach: A two-layered counter-flow ... -
FEM analysis of multifluid heat exchangers
(Emerald Group Publishing Limited, 2004)Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ... -
Optimization of thermal resistance of stacked micro-channel using genetic algorithms
(Emerald Group Publishing Limited, 2005)Purpose - To determine the optimal dimensions for a stacked micro-channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach - GA is used as an optimization tool for optimizing ... -
Steady and unsteady thermal analysis of a triple stack cold plate with heat losses
(Emerald Group Publishing Limited, 2005)Purpose - To provide some new and additional data for the design of a triple stack cold plate. Design/methodology/approach - A detailed finite element formulation for the triple stack cold plate with and without heat losses ... -
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ... -
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)Purpose – The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ... -
Test chip and substrate design for flip chip microelectronic package thermal measurements
(Emerald Group Publishing Limited, 2006)Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ... -
Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM
(Emerald Group Publishing Limited, 2005)Purpose - To analyze two-phase flow in micro-channel heat exchangers used for high flux micro-electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and ... -
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
(Emerald Group Publishing Limited, 2004)This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ... -
Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
(Emerald Group Publishing Limited, 2005)Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...