Browsing Ghulam Abdul Quadir, Prof. Dr. by Author "vmkulkarni1@yahoo.com"
Now showing items 1-1 of 1
-
Numerical simulation of underfill encapsulation process based on characteritsic split method
Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr. (John Wiley & Sons, Inc., 2006)Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...