Browsing Ghulam Abdul Quadir, Prof. Dr. by Author "teck.joo.goh@intel.com"
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Test chip and substrate design for flip chip microelectronic package thermal measurements
Goh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2006)Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ... -
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ganeshamoorthy, K. Jeevan (Emerald Group Publishing Limited, 2004)This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...