Browsing Ghulam Abdul Quadir, Prof. Dr. by Author "Jeevan, Kanesan"

Now showing items 1-6 of 6

    • FEM analysis and experimental validation of flashless cold forging of autonomous underwater vehicle hubs 

      Khaleed, H.M.T.; Z., Samad; A.R., Othman; M.A., Mujeebu; Hussaini, A.; A.B., Abdullah; Magami, I.B.; Salman Ahmed, N.J.; Quadir, G.A.; Jeevan, Kanesan (Universiti Malaysia Perlis, 2009-10-11)
      In this paper three-dimensional FEM analysis and experimental flashless cold forging of aluminum front and back hubs of Autonomous Underwater Vehicle (AUV) propeller is presented. The rigid-plastic finite element simulation ...

    • Optimization of PCB component placement using genetic algorithm 

      Jeevan, Kanesan; Parthiban, A.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (World Scientific Publishing, 2002)
      This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation ...

    • Optimization of thermal resistance of stacked micro-channel using genetic algorithms 

      Jeevan, Kanesan; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To determine the optimal dimensions for a stacked micro-channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach - GA is used as an optimization tool for optimizing ...

    • Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Jeevan, Kanesan (Emerald Group Publishing Limited, 2004)
      This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...

    • Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms 

      Jeevan, Kanesan; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...

    • Thermal management of multichipmodule (MCM) using genetic algorithms 

      Jeevan, Kanesan; Seetharamu, Kankanhally N.; Ishak, I.A.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2003)
      The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. ...