Browsing Ghulam Abdul Quadir, Prof. Dr. by Author "Goh, Teck Joo"

Now showing items 1-7 of 7

    • Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life 

      Lee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Goh, Teck Joo (Emerald Group Publishing, 2006)
      Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ...

    • Fast transient solutions for heat transfer [FEM] 

      Ooi, Chen Hee; Seetharamu, Kankanhally N.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Sim, K. S.; Goh, Teck Joo (IEEE Conference Publications, 2003)
      The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ...

    • Flip chip thermal test vehicle design: Requirements, evaluations, and validations 

      Goh, Teck Joo; Chu, Chia Pin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (ASME, 2003)
      This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ...

    • Optimization of fins used in electronic packaging 

      Ong, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo (Emerald Group Publishing Limited, 2005)
      Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...

    • Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Jeevan, Kanesan (Emerald Group Publishing Limited, 2004)
      This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...

    • Test chip and substrate design for flip chip microelectronic package thermal measurements 

      Goh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2006)
      Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...

    • Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ganeshamoorthy, K. Jeevan (Emerald Group Publishing Limited, 2004)
      This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...