Browsing Ghulam Abdul Quadir, Prof. Dr. by Author "Ghulam, Abdul Quadir, Prof. Dr."

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    • Analysis of microchannel heat exchangers using FEM 

      Ghulam, Abdul Quadir, Prof. Dr.; Mydin, Anvar; Seetharamu, Kankanhally N. (Emerald Group Publishing, 2000)
      A finite element method is applied to evaluate the performance of microchannel heat exchangers that are used in electronic packaging. The present approach is validated against the CFD data available in the literature. A ...

    • Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life 

      Lee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Goh, Teck Joo (Emerald Group Publishing, 2006)
      Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ...

    • Application of artificial neural network for fatigue life prediction 

      Ishak, Abdul Azid, Dr.; Lee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr. (Trans Tech Publications, 2005)
      An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the ...

    • Experimental investigation of a downdraft biomass gasifier 

      Zainal Alimuddin, Zainal Alauddin, Dr.; Ali, Rifau; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2002)
      An experimental investigation of a downdraft biomass gasifier is carried out using furniture wood and wood chips. The effect of equivalence ratio on the gas composition, calorific value and the gas production rate is ...

    • Fast transient solutions for heat transfer [FEM] 

      Ooi, Chen Hee; Seetharamu, Kankanhally N.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Sim, K. S.; Goh, Teck Joo (IEEE Conference Publications, 2003)
      The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ...

    • Flip chip thermal test vehicle design: Requirements, evaluations, and validations 

      Goh, Teck Joo; Chu, Chia Pin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (ASME, 2003)
      This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ...

    • Flow analysis for flip chip underfilling process using characteristic based split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Aswatha Narayana, P. A.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2004)
      In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ...

    • Modeling of wire-on-tube heat exchangers using finite element method 

      Ghulam, Abdul Quadir, Prof. Dr.; Krishnan, Ganapathi M.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2002)
      Wire-on-tube heat exchangers are analysed under normal operating conditions (free convection) using finite element method. Galerkin's weighted residual method is used to minimise the errors. The effects of ambient temperatures ...

    • Numerical analysis and experimental investigation into the performance of a wire-on-tube condenser of a retrofitted refrigerator 

      Ameen, Ahmadul; Mollik, , S. A.; Mahmud, Khizir; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2006)
      The present paper discusses (a) the analysis of a wire-on-tube condenser under varying operating conditions of free convection using FEM, and (b) experimental verification of the performance of two wire-on-tube condensers ...

    • Numerical and experimental heat transfer studies on totally enclosed fan ventilated machines 

      Rajagopal, M. S.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Taylor and Francis Group, LLC, 2002)
      Accurate prediction of temperature distribution in an electrical machine at the design stage is becoming increasingly important. It is essential to know the locations and magnitudes of hot spot temperatures for optimum ...

    • Numerical simulation of underfill encapsulation process based on characteritsic split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr. (John Wiley & Sons, Inc., 2006)
      Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...

    • Optimization of fins used in electronic packaging 

      Ong, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo (Emerald Group Publishing Limited, 2005)
      Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...

    • Optimization of PCB component placement using genetic algorithm 

      Jeevan, Kanesan; Parthiban, A.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr. (World Scientific Publishing, 2002)
      This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation ...

    • Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages 

      Ghulam, Abdul Quadir, Prof. Dr.; Leong, C.B.; Krishnan, G.M.; Seetharamu, Kankanhally N. (IEEE Conference Publications, 2000)
      In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure ...

    • Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Jeevan, Kanesan (Emerald Group Publishing Limited, 2004)
      This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...

    • A quick and accurate estimation of heat losses from a cow 

      Khan, Zahid A.; Irfan Anjum, Badruddin; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2006)
      The mathematical model available in the literature to calculate the skin temperature required to determine the heat loss from the body of an average cow under different environmental and skin-wetness conditions is complex ...

    • Steady and unsteady thermal analysis of a triple stack cold plate with heat losses 

      Beh, Shiao Lin; Ooi, Chen Hee; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Emerald Group Publishing Limited, 2005)
      Purpose - To provide some new and additional data for the design of a triple stack cold plate. Design/methodology/approach - A detailed finite element formulation for the triple stack cold plate with and without heat losses ...

    • Steady state finite element analysis of a double stack cold plate with heat losses 

      Ghulam, Abdul Quadir, Prof. Dr.; Beh, Shiao Lin; Seetharamu, Kankanhally N.; Ahmad Yusoff, Hassan (Springer-Verlag, 2003)
      A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted ...

    • Temperature cycling analysis for ball grid array package using finite element analysis 

      Muhammad Nubli, Zulkifli; Zul Azhar, Zahid Jamal, Dato, Prof. Dr.; Ghulam, Abdul Quadir, Prof. Dr. (Emerald Group Publishing Limited, 2011)
      Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...

    • Test chip and substrate design for flip chip microelectronic package thermal measurements 

      Goh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2006)
      Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...