Browsing Ghulam Abdul Quadir, Prof. Dr. by Issue Date

Now showing items 21-40 of 45

    • Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms 

      Jeevan, Kanesan; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...

    • Optimization of liquid cooling fins in microelectronic packaging 

      Ng, N. T.; Lai, K. W.; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Taylor & Francis Online, 2005)
      The present study investigates the heat transfer from a fin of the combination of cone and frustum of a cone immersed in boiling FC-72. The temperature distribution within the fin is determined with the help of a ...

    • Optimization of fins used in electronic packaging 

      Ong, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo (Emerald Group Publishing Limited, 2005)
      Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...

    • Transient analysis of a liquid solar collector 

      Gyanaprakash, T.; Varadharaju, R.; Kian, Yap Chee; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Khan, Zahid Akhtar; Aswatha Narayana, P. A.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2005)
      An unsteady state analysis of a liquid solar collector is presented. The physical parameters, which govern the system, are identified. The governing equations have been solved using the fourth order Runge-Kutta method for ...

    • A quick and accurate estimation of heat losses from a cow 

      Khan, Zahid A.; Irfan Anjum, Badruddin; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2006)
      The mathematical model available in the literature to calculate the skin temperature required to determine the heat loss from the body of an average cow under different environmental and skin-wetness conditions is complex ...

    • Numerical analysis and experimental investigation into the performance of a wire-on-tube condenser of a retrofitted refrigerator 

      Ameen, Ahmadul; Mollik, , S. A.; Mahmud, Khizir; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N. (Elsevier Ltd., 2006)
      The present paper discusses (a) the analysis of a wire-on-tube condenser under varying operating conditions of free convection using FEM, and (b) experimental verification of the performance of two wire-on-tube condensers ...

    • Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life 

      Lee, Kor Oon; Ong, Kang E.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Goh, Teck Joo (Emerald Group Publishing, 2006)
      Purpose: Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance ...

    • Test chip and substrate design for flip chip microelectronic package thermal measurements 

      Goh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Emerald Group Publishing Limited, 2006)
      Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...

    • Numerical simulation of underfill encapsulation process based on characteritsic split method 

      Kulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr. (John Wiley & Sons, Inc., 2006)
      Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...

    • Fast transient thermal analysis of Fourier and non-Fourier heat conduction 

      Loh, J. S.; Abdul Azid, Ishak; Seetharamu, Kankanhally N.; Quadir, Ghulam Abdul (Elsevier Ltd., 2007-10)
      In this paper, asymptotic waveform evaluation (AWE) has been successfully used for fast transient characterization of Fourier and non-Fourier heat conduction. The Fourier and non-Fourier equations are reduced to a system ...

    • Analysis of stress concentration factor in bolted joint using finite element method 

      Khaleed Hussain, M. T.; Samad, Zahurin; Suhaib, S.; Uthman, A. R.; Jagirdar, S. A.; Badruddin, Irfan Anjum; Mallíck, Zulquernain; Khan, Zahid Akhtar; Abdul Quadir, Ghulam (University of MalayaDepartment of Mechanical Engineering, 2008)
      Bolted joints are widely used in industries e.g. pressure vessels, automobiles, machine tools, home appliances etc., thus it is becoming increasingly important to accurately predict the behavior of bolted joints. The ...

    • Analysis of heat exchanger concentric tube by Finite Element Method 

      Fathul Fahmi, Zainudin (Universiti Malaysia PerlisSchool of Mechatronic Engineering, 2009)
      The objective for this project is to study the performance of heat exchanger in parallel flow and counter flow. This experiment using three different temperature of water like cold, hot and normal temperature. The governing ...

    • Fast transient solution of a two-layered counter-flow microchannel heat sink 

      Beh, S. L.; Tio, K. -K.; Ghulam, Abdul Quadir; Seetharamu, K. N. (Emerald Group Publishing Limited., 2009)
      Purpose: The purpose of this paper is to apply asymptotic waveform evaluation (AWE) to the transient analysis of a two-layered counter-flow microchannel heat sink. Design/methodology/approach: A two-layered counter-flow ...

    • Design and fabrication of a multi-tube heat exchanger 

      Mohd Zaim, Mohd Zukeri (Universiti Malaysia PerlisSchool of Mechatronic Engineering, 2009-04)
      Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ...

    • Performance of gas turbine cycle for combined cycle power plant 

      Mohd Khusairy, Khadzir (Universiti Malaysia PerlisSchool of Mechatronic Engineering, 2009-05)
      The gas turbine based power plant is characterized by its relatively low capital cost compared with the steam power plant. It has environmental advantages and short construction lead time. However, conventional industrial ...

    • Flow analysis for powered inhaler accessory device 

      Mohd Salleh, Abd Rahim (Universiti Malaysia PerlisSchool of Mechatronic Engineering, 2009-05)
      The aim of the study is to analyze the flow characteristics of the powered inhaler accessory device (PIAD), ranging from vortex development and two phase mixture of the inhaler drug. Computational Fluid Dynamics (CFD) ...

    • Design and fabrication of triple concentric pipe heat exchanger 

      Saqab, S. Jarallah; Quadir, G.A. (Universiti Malaysia Perlis, 2009-10-11)
      The objective of this piper is to dsign and fabricate a triple concentric-pipe heat exchanger to be used for the fluid flow and heat transfer analysis of parallel flow and counter flow arrangement of fluids. The three ...

    • Analysis of a Three-Fluid cocurrent and countercurrent parallel flow heat exchanger 

      Jarallah, Saqab S.; Quadir, G.A. (Universiti Malaysia Perlis, 2009-10-11)
      The temperature variation of the fluids in a three-fluid cocurrent and countercurrent parallel flow heat exchanger is measured and compared with the results obtained from the finite element analysis. It is found that finite ...

    • FEM analysis and experimental validation of flashless cold forging of autonomous underwater vehicle hubs 

      Khaleed, H.M.T.; Z., Samad; A.R., Othman; M.A., Mujeebu; Hussaini, A.; A.B., Abdullah; Magami, I.B.; Salman Ahmed, N.J.; Quadir, G.A.; Jeevan, Kanesan (Universiti Malaysia Perlis, 2009-10-11)
      In this paper three-dimensional FEM analysis and experimental flashless cold forging of aluminum front and back hubs of Autonomous Underwater Vehicle (AUV) propeller is presented. The rigid-plastic finite element simulation ...

    • Temperature cycling analysis for ball grid array package using finite element analysis 

      Muhammad Nubli, Zulkifli; Zul Azhar, Zahid Jamal, Dato, Prof. Dr.; Ghulam, Abdul Quadir, Prof. Dr. (Emerald Group Publishing Limited, 2011)
      Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...