Browsing Universiti Malaysia Perlis by Subject "Termoforming mold"
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Epoxy -recycled copper (e-recop) as thermoforming mold materials
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2014-05)• Rigidity and conductivity of metal thermoforming mold is better but it is expensive in term of fabrication process and material; E-REGOP mold is fabricated using simple, fast fabrication method. Lower material cost and ...