Browsing Research & Innovations by Subject "Solder"

Now showing items 1-2 of 2

    • Graphite as an intermetallic compound (IMC) substitution for a robust solder joint 

      Fatin Afeeqa, Mohd Sobri; Norhayanti, Mohd Nasir; Rita, Mohd Said; Mohd Izrul Izwan, Ramli; Muhammad Hafiz, Zan@Hazizi; Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh (Universiti Malaysia Perlis (UniMAP), 2015-04-17)
      Conventionally, Sn-Pb types of solder were highly used in the electronic packaging industries as it excels in most of its properties. But, then it was realized that lead (Pb) were hazardous to the invironment and human ...

    • SAC-SIC : a new potential lead–free composite solder for green technology 

      Zawawi, Mahim; Sayyidah Amnah, Musa; Noraniza, Saud; Nurul Razliana, Abdul Razak (Universiti Malaysia Perlis (UniMAP), 2015-04-17)
      Recently, the development of Sn-Ag-Cu (SAC) has gain attention in electronic packaging industry due to its good reliability in the electronics application. The tin-silver-copper family of alloys has earned a great deal ...