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Ultra-thin body and thin-BOX SOI CMOS technology analog figures of merit
(Elsevier Ltd., 2012-04)
In this paper, we analyze, for the first time to our best knowledge, the perspectives of ultra-thin body and
ultra-thin BOX (UTBB) SOI CMOS technology for analog applications. We show that UTBB is a promising
contender ...
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
(Elsevier Science, 2006)
This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy ...
FPGA based SPWM Bridge Inverter
(Science Publications, 2007)
This study presents methodology to generate sinusoidal pulse width modulation (SPWM)
signal using Field Programmable Gate Array, FPGA technology. We discussed the unipolar switching scheme and the methodology to generate ...
The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
(Science Publications, 2007)
This study reports a number of experiments that were designed to characterize aluminum
bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment ...
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)
This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...
The characterization of power supply noise for optical mouse sensor
(Institute of Electrical and Electronics Engineering (IEEE), 2006)
The induced power supply noise (sinusoidal waveform) that injected to Vdd pin will cause unwanted spike at the positive amplitude and negative amplitude to the DC input voltage. At certain limit this spike will cause the ...
Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
(University of Malaya, 2008)
In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ...
Characteristics of Serial Peripheral Interfaces (SPI) timing parameters for optical mouse sensor
(Institute of Electrical and Electronics Engineering (IEEE), 2006)
In this paper we report the characterizations results of Serial Peripheral Interface (SPI) timing parameters for optical mouse sensor. SPI is an interface that facilitates the transfer of synchronous serial data. It supports ...
The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
(American Institute of Physics, 2007-05-09)
This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond ...