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The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)
This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...
The characterization of power supply noise for optical mouse sensor
(Institute of Electrical and Electronics Engineering (IEEE), 2006)
The induced power supply noise (sinusoidal waveform) that injected to Vdd pin will cause unwanted spike at the positive amplitude and negative amplitude to the DC input voltage. At certain limit this spike will cause the ...
Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
(University of Malaya, 2008)
In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ...
Characteristics of Serial Peripheral Interfaces (SPI) timing parameters for optical mouse sensor
(Institute of Electrical and Electronics Engineering (IEEE), 2006)
In this paper we report the characterizations results of Serial Peripheral Interface (SPI) timing parameters for optical mouse sensor. SPI is an interface that facilitates the transfer of synchronous serial data. It supports ...