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dc.contributor.authorKhoo Chien Chin
dc.date.accessioned2008-10-13T06:31:45Z
dc.date.available2008-10-13T06:31:45Z
dc.date.issued2008-05
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/2390
dc.descriptionAccess is limited to UniMAP community.en_US
dc.description.abstractThis paper discusses the application of a design of experiments (DOE) experimental method for analyzing the influence of four parameters (coating time, spinning speed, and softbake time and softbake temperature).involved in e-beam lithography process. Initially, the experimental methods applied to the lithography process are described. Main focus of this project is to optimize and to characterize the thickness of polymethyl-methacrylate (PMMA) with molecular weights of 950K. The thicknesses of PMMA resists are characterized and optimized to obtain ideal process settings for the best lithography performance. Parameters of lithography can be studied to determine the most significant factor that contributes to optimum performance. Results were evaluated by means of variance analysis (ANOVA) which assessed how the variation in the four different controllable parameters influenced PMMA thickness in lithography. Spinning speed is the main contributing factor to 950K PMMA thickness while coating time, softbake time and softbake temperature were found not important.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlisen_US
dc.subjectLithography, Electron beamen_US
dc.subjectLithographyen_US
dc.subjectPolymethyl-methacrylate (PMMAen_US
dc.subjectLithography -- Techniqueen_US
dc.subjectIntegrated circuitsen_US
dc.subjectNanotechnologyen_US
dc.titleOptimization of 950K PMMA resists for Nano-application using Statistical Design Experten_US
dc.typeLearning Objecten_US
dc.contributor.advisorUda Hashim, P.M. Dr. (Advisor)en_US
dc.publisher.departmentSchool of Manufacturing Engineeringen_US


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