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Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
(Trans Tech Publications, 2013)
This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and ...
A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
(Trans Tech Publications, 2013)
Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver ...
The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)
(Trans Tech Publications, 2013)
The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel ...
Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
(Trans Tech Publications, 2013)
Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid ...