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Now showing items 11-20 of 67
Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
(Department of Mechanical Engineering, University Malaya, 2007)
Flip chip packaging technology has been utilized more than 40 years ago and it still experiencing an explosives growth. This growth is driven by the need for high performance, high volume, better reliability, smaller size ...
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)
This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...
High speed and low power devices : bulk silicon versus SOI
(Kolej Universiti Kejuruteraan Utara Malaysia, 2005-04)
Simulasi Fabrikasi Simpangan Cetek Ultra menggunakan Resapan Dopan daripada SOD (Spin On Dopant)
(Universiti Malaysia Perlis, 2006)
Pembentukan simpangan cetek ultra merupakan suatu proses yang kritikal dalam fabrikasi peranti-peranti submikron bagi teknologi litar terkamil pada masa hadapan. Di dalam penulisan ini, simulasi proses pembentukan simpangan ...
Cost Effective Negative Plenum Cleanroom for Microelectronic Engineering undergraduate
(Kolej Universiti Kejuruteraan Utara Malaysia, 2005)
The Negative Plenum Cleanroom which is design and built by KUKUM is primarily used for the teaching of the undergraduate microelectronic course. The cleanroom is approximately 115m² in size. The level of cleanliness in the ...
Nanotechnology development in Malaysia: current status and implementation strategy
(Universiti Malaysia Perlis, 2008-12-05)
Nano-technology development needs all the support it could get to ensure the technology is being leveled up and benefits all mankind. Malaysia has started it own
micro-technology and nano-technology development since the ...
The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
(Universiti Putra Malaysia (UPM), 2005-12-06)
The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure ...
A new Microelectronic Engineering degree curriculum in KUKUM
(Association of Engineering Education in South East Asia and the Pacific, 2005-12-08)
This paper presents the development and implementation of a new curriculum at the Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM). The curriculum is specifically developed for the Bachelor of Engineering Degree program ...
Technical study of digital display using Peripheral Interface Controller (PIC) microcontroller based system
(Universiti Malaysia Pahang, 2009-06-20)
Digital display system is the most
popular technology and most compatible with the
embedded system devices. The word digital is
most commonly used in computing and
electronics, especially where real-world
information ...
Effect of alignment mark architecture on alignment signal behavior in advanced lithography
(Universiti Malaya, 2007)
Alignment mark architecture is divided into two types, which depending on where the mark is defined. Alignment mark that is defined through the contact masking steps is known as contact mark and alignment mark that is ...