Now showing items 1-2 of 2

    • Micropump pattern replication using Printed Circuit Board (PCB) technology 

      Pei, Song Chee; Rashidah @ Siti Saedah, Arsat, Dr.; Uda, Hashim, Prof. Dr.; Ruzairi, Abdul Rahim, Prof. Dr.; Loew, Pei Ling, Dr. (Taylor and Francis Group, LLC., 2013-06-01)
      This article shows a low-cost rapid hot embossing poly (methylmeth acrylate) (PMMA)-based micropump replication with printed circuit board (PCB) mold. PCB material offers advantages of low cost, rigid, and rapid thermal ...
    • Modular architecture of a non-contact pinch actuation micropump 

      Chee, Pei Song; Rashidah, Arsat. Dr.; Tijjani Adam, Shuwa; Uda, Hashim, Prof. Dr.; Ruzairi, Abdul Rahim, Prof. Dr.; Leow, Pei Ling (MDPI, Basel, Switzerland., 2012-09)
      This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in ...