Browsing Uda Hashim, Prof. Ts. Dr. by Title
Now showing items 232-249 of 249
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Synthesis and film investigation of titania
(Trans Tech Publications, 2014)Titania or titanium dioxide (TiO2) thin film has been synthesized via sol-gel method with monoethanolamine (MEA) as a catalyst. The mixing of titanium butoxide as a precursor, ethanol as a solvent and MEA were stirred using ... -
Synthesis of silicon carbide nanotubes from carbon nanotubes and silicon dioxide by microwaves irradiation
(Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)In this study, an attempt to fabricate silicon carbide nanotubes (SiCNTs) from the reactions between multiwalled carbon nanotubes (MWCNTs) and silicon dioxide (SiO2) is presented. Shape Memory Synthesis (SMS) method ... -
Synthesis of single-walled carbon nanotubes: Effects of active metals, catalyst supports, and metal loading percentage
(Hindawi Publishing Corporation, 2013)The effects of active metals, catalyst supports, and metal loading percentage on the formation of single-walled carbon nanotubes (SWNTs) were studied. In particular, iron, cobalt, and nickel were investigated for SWNTs ... -
A systematic dry etching process for profile control of quantum dots and nanoconstrictions
(Elsevier B.V., 2007-08)In essence, quantum dot dimensions and others can be laterally and vertically defined by using either bottom up or top down methods respectively. In fabrication that uses top down method, etch process hold a chief role. ... -
Taqman real-time polymerase chain reaction for the determination of pork adulteration in meat nuggets
(Vup Food Research Institute, 2012)A TaqMan real-time polymerase chain reaction was developed for the determination of pork adulteration in nuggets. The assay combined species-specific primers and TaqMan probe to target a 109 bp fragment of swine cytochrome ... -
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging
(Hindawi Publishing Corporation, 2012)Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging are the key technical barriers in Cu wire development. This paper discusses the UHAST (unbiased ... -
Technical study of digital display using Peripheral Interface Controller (PIC) microcontroller based system
(Universiti Malaysia Pahang, 2009-06-20)Digital display system is the most popular technology and most compatible with the embedded system devices. The word digital is most commonly used in computing and electronics, especially where real-world information ... -
Technology development for nano structure formation: Fabrication and characterization
(American Scientific Publishers, 2013)The paper contain a report on a technology development for nano structure formation using standard CMOS process-based method capable of fabricating precisely control nano wire and nanogap. The fabrication of nanoscale ... -
Theoretical and experimental study towards fabrication of nanogap dielectric biosensor by reversed spacer lithography
(American Institute of Physics, 2010-03-11)A reversed spacer patterning technology using a sacrificial layer and a chemical vapor deposition (CVD) spacer layer has been developed, and is demonstrated to achieve sub-50 nm structures with conventional dry etching. ... -
Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad
(The Electrochemical Society, 2009-03-17)This paper presents the study of the thermal aging of the gold ball bonds and aluminum bond pad at 150 °C and 200 °C for various interval times. Process decapsulation and Field Emission Scanning Electron Microscopy (FESEM) ... -
Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
(Trans Tech Publications, 2014)One of the advantages of silicon substrate over other semiconductor substrate is the high temperature process capability of the silicon. In this work, silicon wafer is used for thermal processing which involves many high ... -
Three-dimensional channel design and fabrication in Polydimethylsiloxane (PDMS) elastomers using capillary action mechanism in fluidics for life sciences
(AENSI Publications, 2012-04)A simple design and fabrication for a 3D microchannel that could be used as a mixer in microfluidic flow system with minimum sample available, analysis using COMSOL 3.5 Multiphysics simulation and fabricated using ... -
Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
(Department of Mechanical Engineering, University Malaya, 2007)Flip chip packaging technology has been utilized more than 40 years ago and it still experiencing an explosives growth. This growth is driven by the need for high performance, high volume, better reliability, smaller size ... -
An Undergraduate Micro Fabrication Course at the Northern Malaysia University College of Engineering
(Kolej Universiti Kejuruteraan Utara Malaysia, 2004)This paper presents the development of a new course conducted by the School of Microelectronic Engineering at the Northern Malaysia University College of Engineering or Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM) ... -
The usage of max 262 as a programmable low pass filter for nanogap automated permittivity measurement system
(Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)The Nanogap Automated Permittivity Measurement System (APMS) are fabricated for low cost, portable and label free DNA hybridization detection kit. The nanogap capacitor can react as a DNA sensor. The difference ... -
VIS-NIR spectral and particles distribution of Au, Ag, Cu, Al and Ni nanoparticles synthesized in distilled water using laser ablation
(Elsevier, 2019-07)In this research, gold (Au), silver (Ag), copper (Cu), aluminium (Al) and nickel (Ni) nanoparticles have been prepared by laser ablation in distilled water using Q-switched Nd: YAG. Comparative analysis between 1064 nm and ... -
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
(Hindawi Publishing Corporation, 2013)Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with ... -
ZnO thin film deposition on butterfly shaped electrodes for ultravioletsensing applications
(Elsevier GmbH, 2013-12)ZnO thin film was deposited on patterned gold electrodes using sol-gel spin coating technique. Conven-tional photo-lithography with wet etching process was used to create butterfly shaped 13-m gap fromzero gap chrome mask. ...