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dc.contributor.authorAnbu Johnson, Dr.
dc.contributor.authorRagunathan Santiagoo
dc.contributor.authorNing Yan
dc.date.accessioned2008-05-21T01:32:55Z
dc.date.available2008-05-21T01:32:55Z
dc.date.issued2007-06-09
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/1177
dc.descriptionOrganized by Universiti Malaysia Perlis (UniMAP), 9th - 12th June 2007 at Park Royal Hotel, Penang.en_US
dc.description.abstractIt is well known that wood has a marked influence on the cure mechanism of phenolic resins. Since the durability and strength of wood based composites depend on the cured state of the binder, it is important to employ a technique which can identify the wood species which can enhance or retard the curing reaction. It has been shown using the micro-thermal analysis (μ-TA™) that curing behaviour of liquid phenol-formaldehyde resin is significantly affected by the substrates. Essential thermal parameters such as glass transition temperature and cure onset were detected. It was found that certain wood species, such as pine and oak, accelerated the curing rate while other substrates, such as birch and glass substrate retarded the resin curing. The exothermic event associated with the phenol-ormaldehyde curing was also detected for wood substrates which was almost absent in the case of glass substrate. This seems to suggest that wood has certain catalytic effect on the curing of the phenol-formaldehyde resin.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.relation.ispartofseries1st International Conference on Sustainable Materials 2007 (ICoSM2007)en_US
dc.subjectWood compositesen_US
dc.subjectPhenol-formaldehydeen_US
dc.subjectResinsen_US
dc.subjectFormaldehydeen_US
dc.subjectPhenolic resinsen_US
dc.subjectChemical Engineeringen_US
dc.subjectMicro-thermal analysisen_US
dc.titleCure Behaviour Study of Phenol Formaldehyde on Wood Surface Using Micro-Thermal Analysisen_US
dc.title.alternative1st International Conference on Sustainable Materials 2007 (ICoSM2007)en_US
dc.typeWorking Paperen_US


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