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The outcome of sintering parameters study toward the thermal properties of CuSiC composite
(Trans Tech Publications, 2014)
Miniaturisation of electronic chips which have increasing functionality within the same package size has induced significant increases in requirements for extraction of heat from the integrated circuit (IC). Packaging ...
Effect of space holder and compaction pressure on the porosity of sintered copper
(Trans Tech Publications, 2013)
The effect of space-holder content on the porosity of sintered copper that was fabricated by powder metallurgy technique has been investigated. Carbamide was used as space-holder and the content selected was 10 wt. %, 20 ...