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Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
(Emerald Group Publishing Limited, 2005)
Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...
Optimization of fins used in electronic packaging
(Emerald Group Publishing Limited, 2005)
Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...