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Steady and unsteady thermal analysis of a triple stack cold plate with heat losses
(Emerald Group Publishing Limited, 2005)
Purpose - To provide some new and additional data for the design of a triple stack cold plate. Design/methodology/approach - A detailed finite element formulation for the triple stack cold plate with and without heat losses ...
Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM
(Emerald Group Publishing Limited, 2005)
Purpose - To analyze two-phase flow in micro-channel heat exchangers used for high flux micro-electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and ...
Application of artificial neural network for fatigue life prediction
(Trans Tech Publications, 2005)
An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the ...
Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
(Emerald Group Publishing Limited, 2005)
Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...
Optimization of fins used in electronic packaging
(Emerald Group Publishing Limited, 2005)
Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...
Transient analysis of a liquid solar collector
(Elsevier Ltd., 2005)
An unsteady state analysis of a liquid solar collector is presented. The physical parameters, which govern the system, are identified. The governing equations have been solved using the fourth order Runge-Kutta method for ...