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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2013)
The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
(Syscom 18 SRL, 2013-07)
The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ...
Microstructure and interface analysis of glass particulate reinforced aluminum matrix composite
(Trans Tech Publications (TTP), 2013)
A characterization of microstructure and interface was made on the composites Al- 4% Cu reinforced with 15 wt. % glass particulate. The composite was fabricated by powder metallurgy followed by solution treatment and ...
Effect of space holder and compaction pressure on the porosity of sintered copper
(Trans Tech Publications, 2013)
The effect of space-holder content on the porosity of sintered copper that was fabricated by powder metallurgy technique has been investigated. Carbamide was used as space-holder and the content selected was 10 wt. %, 20 ...