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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2013)
The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
Effect of compatibilizer on mechanical properties and water absorption behaviour of coconut fiber filled polypropylene composite
(Trans Tech Publications, 2013-03)
Compatibilizer is used to improve mechanical properties and water absorption behaviour of polypropylene/coconut fiber (PP/CF) composites by promoting strong adhesion between CF filler and PP Matrix. Maleic Anhydride Grafted ...
Sol-gel synthesis and preliminary characterizations of novel silica hybrid xerogels
(Trans Tech Publications, 2013-12)
Hybrid silica xerogel mesoporous composite was synthesized by a mild temperature acid catalysed sol-gel route where a natural copolymer; sodium alginate (Na-COOH) together with calcium oxide (CaO) powder were incorporated ...
The effect of different alkaline treatment condition on flexural properties of kenaf bast- unsaturated polyester composite
(Trans Tech Publications, 2013)
The biocomposites were prepared by using kenaf bast fiber mat as reinforcing materials at different percentage. The kenaf bast fiber was treated with alkaline at different sodium hydroxide (NaOH) percentage. From the results ...
Synthesis and characterization of pure magnesium/bio-glass composite
(Trans Tech Publications, 2013)
In this study, bio-glass 45S5 powder was added to pure magnesium powder to produce the magnesium/bio-glass composite by powder metallurgy method. The composite was synthesized based on 5 wt. %, 10 wt. % and 15 wt. % of ...
Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
(Trans Tech Publications, 2013)
Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for ...
Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
(Trans Tech Publications, 2013)
The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its ...